High Quality Probe Advanced Material Structure Lean Plating High Quality Assembly Process
Mechanical: · Pitch (Minimum): · Recommended travel: · Operating temperature: | 0.40mm 0.30mm -55°C to 120°C |
Electrical: · Typical Resistance (Avg): · Current carrying capability: · Bandwidth @-1dB IL (GSG): · Loop inductance: · Capacitance: | <60 mΩ 2.0 A >25 GHz 0.29nH 0.23 pF |
Material: · Bottom plunger: · Barrel: · Spring: | BeCu, Gold plated Phosphorous bronze, Gold plated Music wire, Gold plated |
X1XX | Mechanical | Material | ||
Application | Working Force | Tip (Top/Bottom plunger) | Top plunger | |
0112 | BGA/QFN | 30.0g | 4-pts Crown/ Radius | Pd Alloy |
0121 | LGA/QFN | 27.0g | Radius / Radius | BeCu, Gold plated |
0122 | LGA/QFN | 27.0g | Radius / Radius | Pd Alloy |
1122 | LGA/QFN | 20.0g | Radius / Radius | Pd Alloy |